Adhesion at TiNi interfaces with Ta, Mo and Si
نویسندگان
چکیده
منابع مشابه
1 ELECTRONIC EFFECTS AT INTERFACES IN Cu - Cr , Mo , W , Ta , Re MULTILAYERS
Interfacial electronic effects between Cu and the transition metals Cr, Mo, W, Ta, Re, are investigated by determining the strength of the white line absorption resonances on the L3,2 edges of Cu in Cu5/TM5 multilayers. X-ray absorption (XAS) was performed to study the white lines, which are directly related to the unoccupied states of Cu in the multilayers. The metallic multilayers are 2 nm in...
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The thermopower of W, Mo, Ta, Li and Sn has been measured relative to stainless steel, and the Seebeck coefficient of each of these materials has then been calculated. These are materials that are currently relevant to fusion research and form the backbone for different possibl e liquid limiter concepts includ ing TEMHD concepts such as LiMIT. For molybdenum the Seebeck coefficient has a linear...
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ژورنال
عنوان ژورنال: MATEC Web of Conferences
سال: 2015
ISSN: 2261-236X
DOI: 10.1051/matecconf/20153303006